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No. STSE-CC5172B
SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE
MODEL : NFSW036LT
LED
NICHIA CORPORATION
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Nichia STSE-CC5172B
1.SPECIFICATIONS
(1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Soldering Temperature
IFP Conditions :
Symbol IF IFP IR PD Topr Tstg Tj Tsld
Absolute Maximum Rating 180 350 85 684 -40 ~ +100 -40 ~ +100 130 Reflow Soldering : 260C Hand Soldering : 350C
and Duty < 1/10 =
(Ts=25C) Unit mA mA mA mW C C C for 10sec. for 3sec.
Pulse Width < 10msec. =
(2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Intensity Iv Luminous Flux v x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram.
Condition IF=150[mA] IF=150[mA] IF=150[mA] IF=150[mA] IF=150[mA]
Typ. (3.5) (16.0) (20.0) 0.31 0.32
(Ts=25C) Max. Unit 3.8 V cd lm -
(3) Ranking Item Luminous Intensity Rank T Rank S Symbol Condition Iv IF=150[mA] Iv IF=150[mA] Min. 16.3 11.5
(Ts=25C) Max. Unit 23.0 cd 16.3 cd
Luminous Intensity Measurement allowance is 10%.
Color Ranks x y x y x y 0.280 0.248 0.287 0.295 0.296 0.276 Rank a0 0.264 0.283 0.267 0.305 Rank b3 0.283 0.304 0.305 0.330 Rank b5 0.287 0.307 0.295 0.315 0.296 0.276 0.307 0.315 0.311 0.294 x y x y 0.307 0.315 0.311 0.294
(IF=150mA,Ts=25C)
Rank b4 0.304 0.330 0.330 0.360 Rank b6 0.307 0.330 0.315 0.339
0.330 0.339 0.330 0.318
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Nichia STSE-CC5172B Rank c1 0.330 0.361 0.360 0.385 Rank c2 0.330 0.357 0.339 0.361
x y
0.330 0.339
0.357 0.361
x y
0.330 0.318
0.356 0.351
Color Coordinates Measurement allowance is 0.01.
2.INITIAL 3.OUTLINE
OPTICAL/ELECTRICAL DIMENSIONS AND
CHARACTERISTICS MATERIALS
: : : : Ceramics Silicone Resin (with Diffused + Phosphor) Ag Plating Silicone Resin
Please refer to figure's page.
Please refer to figure's page. Material as follows ; Package Encapsulating Resin Electrodes Lens
4.PACKAGING
* The LEDs are packed in cardboard boxes after taping. Please refer to figure's page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT
NUMBER
The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 6 for 2006, 7 for 2007 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Intensity
B for Nov. )
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6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (Lead Solder) -40C ~ 100C 1min. (10sec.) 1min. (Pre treatment 30C,70%,168hrs.) -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. 25C ~ 65C ~ -10C 90%RH 24hrs./1cycle Ta=100C Ta=60C, Ta=-40C Ta=25C, IF=180mA
Tested with Nichia standard circuit board.
Nichia STSE-CC5172B
Note 2 times
Number of Damaged 0/22
1 time over 95% 100 cycles
0/22 0/50
Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Permanence of Marking
100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 1000 hrs. 1 time
0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/22
RH=90%
Ta=100C, IF=50mA
Tested with Nichia standard circuit board.
60C, RH=90%, IF=100mA
Tested with Nichia standard circuit board.
Ta=-40C, IF=150mA
Tested with Nichia standard circuit board.
JEITA ED-4701 500 501 JEITA ED-4701 400 403 JEITA ED-4701 300 304
Vibration
Electrostatic Discharges
Solvent : Isopropyl Alcohol Solvent Temperature : 20 ~ 25C Dipping Time : 5 min. 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles R=1.5k, C=100pF Test Voltage=2kV
48min.
0/10
3 times
Negative/Positive
0/22
Thermal resistance of LED with Nichia standard circuit board : Rja 140C/W Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm (2) CRITERIA FOR JUDGING DAMAGE Item Symbol Test Conditions Forward Voltage VF IF=150mA Initial Level Luminous Intensity Iv IF=150mA Initial Level 0.7 The test is performed after the board is cooled down to the room temperature.
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Criteria for Judgement Min. Max.
1.1
Nichia STSE-CC5172B
7.CAUTIONS
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs.
(1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in the moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following condition. Baking treatment : more than 24 hours at 65 5C * Nichia LED electrodes are silver plated. The silver surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Static Electricity * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA)
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Nichia STSE-CC5172B (4) Designing the position of LED on a board. * No twist / warp / bent / or other stress shall be applied to the board after mounting LED with solder to avoid a crack of LED package. Refer to the following recommended position and direction of LED. No good Recommended Direction
Cathode mark
Cathode mark
Appropriate LED mounting is to place perpendicularly against the stress affected side. * Depending on the position and direction of LED, the mechanical stress on the LED package can be changed. Refer to the following figure.
Perforated line

Slit Stress : A > B = C > D > E * Do not split board by hand. Split with exclusive special tool. * If an aluminum circuit board is used, a large stress by thermal shock might cause a solder crack. For this reason, it is recommended an appropriate verification should be taken before use.
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(5) Soldering Conditions * The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. * Recommended soldering conditions
Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200C 120 ~ 150C 120 sec. Max. 120 sec. Max. 240C Max. 260C Max. Hand Soldering Temperature Soldering time 350C Max. 3 sec. Max. (one time only)
Nichia STSE-CC5172B
10 sec. Max. 10 sec. Max. refer to refer to Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure.
<1 : Lead Solder>
2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max.
<2 : Lead-free Solder>
240C Max. 10sec. Max. 1 ~ 5C / sec. 1 ~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max. 260C Max. 10sec. Max.
2.5 ~ 5C / sec.
Above 200C
Above 220C
[Recommended soldering pad design]
4 .5 1 .4
120sec.Max.
Use the following conditions shown in the figure.
120sec.Max.
3 .7
(Unit : mm)
* Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * When soldering, do not put stress on the LEDs during heating. (6) Cleaning * It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. * Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
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Nichia STSE-CC5172B (7) Heat Generation * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS in this specifications. Please also take measures to remove heat from the area near the LED to improve the operational characteristics of the LED. * The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation between Tj and Ts. Tj=Ta + Rja W 1 Tj=Ts + Rjs W 2 Tj = Dice Temperature : C, Ta = Ambient Temperature : C, Ts = Solder Temperature (Cathode Side) : C, Rja = Heat resistance from Dice to Ambient temperature : C /W, Rjs = Heat resistance from Dice to Ts measuring point 85C /W, W = Inputting Power (IF VF) : W (8) Others * NFSW036L complies with RoHS Directive. * The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. * Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. * The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). * User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. * The formal specifications must be exchanged and signed by both parties before large volume purchase begins. * The appearance and specifications of the product may be modified for improvement without notice.
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Nichia STSE-CC5172B
ICI Chromaticity Diagram
0.9 520 530 0.8 510 0.7 550 540
560 0.6 570 500 0.5 580 590
y
0.4 b4 b3 0.3 490 a0 b5
c1
600 610 620 630
c2 b6
0.2
0.1
480 470 460 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0
x
Color Coordinates Measurement allowance is 0.01.
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Forward Voltage vs. Forward Current
1000 Forward Current IFP (mA) Ta=25C Relative Luminosity (a.u.)
Forward Current vs. Relative Luminosity
2.5 Ta=25C 2.0 1.5 1.0 0.5 0 0 100 200 300 400 500 Forward Current IFP (mA) Allowable Forward Current IFP (mA)
Duty Ratio vs. Allowable Forward Current
1000 Ta=25C 500 350
150 100 50
180 100 1 Pulse Width < 10msec. = 5 10 20 50 100 Duty Ratio (%)
10 2.5
3.0 3.5 4.0 4.5 5.0 Forward Voltage VF (V)
Ambient Temperature vs. Forward Voltage
5.0 Forward Voltage VF (V) IFP=150mA 4.5 4.0 3.5 3.0 2.5 -60 -30 0 30 60 90 120 Ambient Temperature Ta (C) Relative Luminosity (a.u.)
Ambient Temperature vs. Relative Luminosity
2.0 IFP=150mA 1.0 Allowable Forward Current IF (mA)
Ambient Temperature vs. Allowable Forward Current
250 200 180 150
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0.5
71 56 46 0 0
Rja=110C/W Rja=140C/W Rja=170C/W
0.2 -60 -30 0 30 60 90 120 Ambient Temperature Ta (C)
20 40 60 80 100 120 Ambient Temperature Ta (C)
Nichia STSE-CC5172B
Model
NFSW036L
NICHIA CORPORATION
Title No.
CHARACTERISTICS
070419547292
Forward Current vs. Chromaticity Coordinate
Relative Emission Intensity (a.u.)
Spectrum
1.2 1.0 0.8 0.6 0.4 0.2 0 350 450 550 650 Wavelength (nm) 750 Ta=25 IFP=150mA
0.34 Ta=25C 0.33 0.32 0.31 0.30 0.29
20mA 40mA 80mA 150mA 180mA 350mA
y
0.30
0.31
0.32
0.33
x Ambient Temperature vs. Chromaticity Coordinate
0.34
Relative Luminosity (a.u.)
Directivity
1.0 0 Ta=25C IFP=150mA 10 20 30 40 50 0.5 60 70 80 0 90 60 30 Radiation Angle 0 0.5 90 1.0
IFP=150mA 0.33 0.32 0.31 0.30 0.29
100C -40C 0C 25C 50C
y
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0.30
0.31
0.32
0.33
x
Nichia STSE-CC5172B
Model
NFSW036L
NICHIA CORPORATION
Title No.
CHARACTERISTICS
070419547302
3.5 2.8
0.8 0.2
3.3 1.6
3.5
Cathode mark
Anode
3.3
Cathode
A 2.6
K
-11-
Protection device
ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES LENS
MATERIALS Ceramics Silicone Resin (with Diffused + Phosphor) Ag Plating Silicone Resin
Nichia STSE-CC5172B
Model
NFSW036L
NFSW036L has a protection device built in as a protection circuit against static electricity.
Unit mm 8/1 Scale Allow 0.2
NICHIA CORPORATION
Title No.
OUTLINE DIMENSIONS
051116547311
Taping part
1.5+0.1 -0 80.1 20.05 40.1 1.750.1 0.250.05
Reel part
3300.2
17.51 13.50.5
5.50.05
Cathode mark
12+0.3 - 0.1
2
3.70.1
1 0.8
0.2
13
1.5+0.2 -0
3.70.1
2.850.1
Label XXXX LED
TYPE NFSx036LT LOT xxxxxxQTY pcs
Reel End of tape
No LEDs
LEDs mounting part
No LEDs
801
-12Pull direction Top cover tape Embossed carrier tape Reel Lead Min.160mm (No LEDs) Reel Lead Min.100mm (No LEDs) Reel Lead Min.400mm
Nichia STSE-CC5172B
3,000pcs/Reel
Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. (NOTE) When LED surface-mounting machines are used, special nozzles are required.
Model
NFSx036LT
Unit mm Scale Allow
NICHIA CORPORATION
Title No.
TAPING DIMENSIONS
051116547321
Nichia STSE-CC5172B The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed.
Moisture proof foil bag
Reel Label
NICHIA
Seal
XXXX LED
TYPE LOT QTY NFSx036LT xxxxxxPCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture absorbent material
The box is partitioned with the cardboard.
Label
NICHIA
Nichia
LED
XXXX LED
TYPE RANK QTY NFSx036LT PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag Cardboard box Cardboard box S Reel/bag 1reel Quantity/bag (pcs) 3,000 MAX. Reel/box 5reel MAX. Quantity/box (pcs) 15,000 MAX.
Dimensions (mm) 391 379 149 8t
Model
NFSx036LT
NICHIA CORPORATION
Title No.
PACKING
051116547331
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